What Are The Requirements For Pressed Targets Used In Reactive Sputtering? Achieve High-Performance Banboxny Films

The primary requirements for pressed targets used in the reactive sputtering of BaNbOxNy thin films are excellent electrical conductivity and high mechanical strength. These targets are typically multi-phase materials fabricated by pressing mixed powders, specifically Ba3N2 and NbN, under high pressure to ensure they can withstand the rigorous sputtering environment.

Core Takeaway Because manufacturing large, dense oxynitride ceramic targets is technically difficult, the industry relies on high-pressure pressed powder targets. To function correctly, these targets must overcome the inherent fragility of powders by achieving sufficient density to resist ion bombardment and adequate conductivity to ensure uniform film deposition.

Composition and Fabrication

The Material Mixture

The targets are not single-phase ceramics but rather multi-phase materials. They are created by mixing specific precursor powders to achieve the desired stoichiometry.

Specific Powder Components

The standard mixture for these targets involves Ba3N2 (Barium Nitride) and NbN (Niobium Nitride). These components are selected to introduce the necessary Barium and Niobium elements into the deposition process.

The Pressing Process

These powders must be subjected to high-pressure pressing. This is critical to transform loose powder into a solid form that mimics the behavior of a dense ceramic during the sputtering process.

Critical Performance Requirements

Electrical Conductivity

The target must exhibit excellent electrical conductivity. Without high conductivity, the sputtering process becomes inefficient or unstable, leading to poor film quality.

Ensuring Uniformity

Conductivity is also directly linked to the uniform deposition of the thin film components. A conductive target ensures a stable discharge, allowing the BaNbOxNy film to grow evenly across the substrate.

Mechanical Strength

The target must possess robust mechanical strength. The sputtering environment involves intense physical stress, specifically from the bombardment of high-energy ions.

Resistance to Ion Bombardment

If the target lacks sufficient strength, the ion bombardment can disintegrate the pressed powder. A weak target will fail mechanically, contaminating the vacuum chamber or halting the deposition process entirely.

Understanding the Trade-offs

The Manufacturing Challenge

Creating large, dense oxynitride ceramic targets is notoriously difficult. The material properties often lead to cracking or density issues during traditional sintering.

The Pressed Powder Solution

High-pressure pressed powder targets are the practical solution to this manufacturing bottleneck. However, the trade-off is that they are inherently less stable than a perfect ceramic, making the strict requirements for density and pressure non-negotiable to avoid failure.

Making the Right Choice for Your Goal

To ensure the successful deposition of BaNbOxNy films, prioritize the physical integrity of your target fabrication:

If your primary focus is Process Stability: Ensure the pressing pressure is maximized to create high mechanical strength, preventing target disintegration during ion bombardment.
If your primary focus is Film Uniformity: Verify that the ratio of Ba3N2 and NbN powders results in a target with high electrical conductivity to maintain a stable plasma discharge.

Success in this deposition process relies entirely on bridging the gap between loose powder and solid ceramic through high-pressure fabrication.

Summary Table:

Requirement	Specification	Importance in Sputtering
Material Composition	Ba3N2 and NbN mixed powders	Introduces necessary Barium and Niobium elements
Electrical Conductivity	Excellent / High	Ensures stable discharge and uniform film deposition
Mechanical Strength	High-pressure pressed	Resists disintegration under intense ion bombardment
Physical State	Multi-phase solid	Overcomes the difficulty of manufacturing dense ceramic targets

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References

Yuji Masubuchi, Shinichi Kikkawa. Processing of dielectric oxynitride perovskites for powders, ceramics, compacts and thin films. DOI: 10.1039/c4dt03811h

This article is also based on technical information from Kintek Press Knowledge Base .