How Does Achieving Low Porosity Differ Between Bimodal And Conventional Structures? Unlock Precision In Battery Design

The core difference lies in utilizing geometry rather than force. In conventional monomodal structures, achieving low porosity requires high pressure to physically crush particles together, often causing damage. Bimodal structures, however, employ a "particle grading" design where small particles fill the natural voids between larger ones, allowing the material to reach a low porosity of 30% at significantly lower calendering pressures.

Key Insight: Bimodal structures decouple density from destructive force. By filling interstitial voids with smaller particles, you increase the theoretical packing density limit naturally, eliminating the need for the excessive compression that degrades traditional electrodes.

The Mechanics of Particle Packing

The Limitation of Conventional Structures

Conventional electrode structures are typically "monomodal," meaning the particles are roughly similar in size. When these particles are stacked, large gaps naturally form between them.

To reduce porosity in this arrangement, pressure equipment must apply immense force. The only way to close these gaps is to physically deform or fracture the particles to make them fit closer together.

The Bimodal Advantage: Particle Grading

Bimodal structures solve this problem through design rather than force. They combine large "secondary" particles with smaller "primary" particles (often produced through pulverization).

This approach utilizes the principle of particle grading. The smaller particles flow into the "interstitial voids"—the empty spaces—that exist between the larger secondary particles.

Efficiency in Pressure Application

Because the voids are filled geometrically by the smaller particles, the theoretical packing density of the material increases automatically.

Consequently, the pressure equipment does not need to work as hard. You can achieve a target low porosity of 30% using much lower calendering pressure compared to what is required for conventional structures.

Understanding the Trade-offs: The Cost of Compression

While high density is desirable, how you achieve it matters. It is critical to understand the specific risks associated with the high-pressure requirements of conventional structures.

Structural Integrity vs. Brute Force

In conventional structures, the high pressure required to minimize porosity comes with a penalty. The mechanical stress frequently leads to secondary particle breakage.

This damage degrades the active material before the battery is even finished. Bimodal structures mitigate this by achieving the same density results without subjecting the material to destructive mechanical stress.

Making the Right Choice for Your Goal

When selecting an electrode structure design, consider whether your priority is manufacturing efficiency or material longevity.

If your primary focus is material integrity: Adopt a bimodal structure to achieve high density at lower pressures, thereby preventing secondary particle breakage and mechanical damage.
If your primary focus is maximizing density: Utilize the bimodal particle grading design to exploit the increased theoretical packing density limit that monomodal structures cannot physically achieve.

Bimodal structures offer a superior pathway to low porosity by prioritizing efficient spatial arrangement over raw mechanical force.

Summary Table:

Feature	Conventional (Monomodal)	Bimodal Structure
Mechanism	Mechanical force (brute force)	Particle grading (geometry)
Particle Size	Roughly uniform	Mixed (large + small particles)
Pressure Req.	High (often destructive)	Significantly lower
Structural Risk	High particle breakage/fracture	Preserved material integrity
Packing Density	Limited by particle shape	Higher theoretical limits

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References

Alexis Luglio, Ryan Brow. Maximizing calendering effects through the mechanical pulverization of Co-free nickel-rich cathodes in lithium-ion cells. DOI: 10.1557/s43577-025-00936-5

This article is also based on technical information from Kintek Press Knowledge Base .