Battery supporting materials
Gold Plated 304SS Stainless Steel 2032 Coin Cell Cases with Spacers and Wave Springs
Item Number : FZ05
Price varies based on specs and customizations
- Substrate & Coating
- 304SS with 300-500 Å Plasma-Sputtered Gold
- Cell Form Factor
- 2032 (20.0 mm Dia x 3.2 mm Height)
- Internal Hardware
- Gold-Plated 15.5 mm Spacer & Wave/Conical Spring
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Product Overview


This high-performance coin cell hardware assembly provides an ultra-reliable platform for precision electrochemical research and battery material testing. Fabricated from premium 304 stainless steel and treated with a specialized plasma-sputtered gold coating (300–500 Å), the assembly provides an extraordinarily stable electrochemical window while effectively suppressing anodic oxidation and electrolyte corrosion. Each set includes a precisely formed positive can, negative cap with an integrated polypropylene sealing gasket, a gold-plated spacer disc, and a gold-plated wave or conical spring to ensure complete internal stack integrity.
Engineered specifically to meet the exacting standards of battery R&D laboratories, academic institutions, and materials science research facilities, this assembly excels across demanding test regimes. It is ideal for evaluating lithium-ion cathode and anode active materials, solid-state electrolytes, sodium-ion chemistries, and next-generation energy storage formulations. The gold-metallized contact surfaces dramatically lower interfacial contact resistance and prevent parasitic surface reactions that could otherwise compromise experimental data.
Manufactured under stringent dimensional and metallurgical quality standards, the cell hardware delivers outstanding mechanical sealing reliability and repeatable crimping performance. Whether subjected to extended galvanostatic cycling, high-temperature environmental testing, or wide-potential cyclic voltammetry, this system maintains hermetic sealing and uniform internal mechanical pressure. Researchers can rely on its robust architecture to eliminate hardware-induced experimental artifacts and secure reproducible electrochemical results.
Key Features
- Plasma-Sputtered Gold Metallization: Coated with a uniform 300–500 Å gold layer via plasma sputtering, the hardware provides superior corrosion resistance and prevents metal dissolution at elevated operating voltages.
- High-Purity 304 Stainless Steel Substrate: Offers superior mechanical rigidity, pressure containment, and structural stability during high-pressure crimping and long-term volumetric expansion cycles.
- Integrated Polypropylene Sealing Gasket: Features a precision-molded polypropylene (PP) O-ring on the negative cap that forms a leak-tight, hermetic seal to prevent electrolyte evaporation and ambient contamination.
- Matched Gold-Plated Spacers: Includes 15.5 mm diameter spacer discs with uniform gold plating to guarantee low interfacial ohmic resistance and optimal electrical continuity across electrode interfaces.
- Resilient Wave and Conical Spring Options: Provides calibrated, uniform axial compression throughout the cell stack, effectively accommodating active material expansion and contraction during continuous charge-discharge cycling.
- Broad Chemical and Electrolyte Compatibility: Chemically inert surface finish eliminates unwanted catalytic reactions with aggressive liquid electrolytes, organic solvents, ionic liquids, and solid-state separator interfaces.
- Customizable Functional Coatings: Available with custom metallization layers including aluminum (Al), platinum (Pt), and silver (Ag) to match specific electrochemical work functions and testing criteria.
- Precision Dimensional Tolerances: Tight dimensional manufacturing guarantees seamless compatibility with standard laboratory coin cell crimpers, automated cell handling systems, and testing channels.
Applications
| Application | Description | Key Benefit |
|---|---|---|
| High-Voltage Lithium-Ion R&D | Testing high-voltage cathode materials (e.g., LNMO, HV-LCO, NMC811) exceeding 4.2V vs. Li/Li+ | Suppresses anodic dissolution and parasitic electrolyte oxidation at elevated potentials. |
| Solid-State Battery Research | Assembling and testing solid electrolyte pellets and composite sulfide/oxide/polymer systems | Delivers uniform axial pressure and low contact impedance across rigid solid-solid interfaces. |
| Sodium-Ion & Potassium-Ion Cells | Investigating alkali-metal battery chemistries and non-aqueous electrolyte formulations | Provides chemical inertness against corrosive electrolyte salts and aggressive reaction byproducts. |
| Electrochemical Impedance Spectroscopy (EIS) | Conducting precise fundamental impedance, interfacial resistance, and kinetic transport studies | Eliminates native oxide-layer impedance artifacts to provide clean, accurate baseline Nyquist plots. |
| Supercapacitor & Hybrid Systems | Characterizing high-rate electrical double-layer capacitors (EDLC) and pseudocapacitive electrode materials | Minimizes equivalent series resistance (ESR) through high-conductivity gold contact surfaces. |
| Corrosive Electrolyte Additive Screening | Evaluating novel fluorinated solvents, highly concentrated electrolytes, and ionic liquids | Plasma-sputtered gold barrier prevents substrate pitting and chemical degradation over extended cycling. |
Technical Specifications
| Parameter | Specification (Item: FZ05) |
|---|---|
| Cell Format | CR2032 Standard (20 mm Diameter × 3.2 mm Height) |
| Primary Substrate Material | AISI 304 Stainless Steel (304SS) |
| Surface Treatment Process | High-Adhesion Plasma Sputtering |
| Standard Plating Material | Gold (Au) |
| Plating Layer Thickness | 300 Å – 500 Å (30 nm – 50 nm) |
| Optional Custom Metallization | Aluminum (Al), Platinum (Pt), Silver (Ag) |
| Sealing Gasket Material | High-Density Polypropylene (PP) O-Ring (Negative Cap) |
| Coin Cell Case Weight | 0.12 oz (~3.4 g per set) |
| Spacer Disc Dimensions | 15.5 mm Diameter × 0.5 mm Thickness (Custom thickness available) |
| Spacer Surface Finish | Plasma-Sputtered Gold Plated |
| Spacer Net Weight | 0.10 oz (~2.8 g) |
| Curved / Wave Spring Dimensions | 14.5 mm O.D. × 10.25 mm I.D. × (1.2 ± 0.05) mm Height × 0.3 mm Thickness |
| Conical Spring Dimensions | 15.4 mm Outer Diameter × (1.2 ± 0.03) mm Height × 0.2 mm Thickness |
| Spring Surface Finish | Plasma-Sputtered Gold Plated |
| Spring Net Weight | 0.10 oz (~2.8 g) |
| Standard Packaging Unit | Sealed Cleanroom Moisture-Barrier Pack (10 Sets / Bag) |
Why Choose This Product
- Elimination of Experimental Artifacts: Native passive films on untreated stainless steel can corrode or develop high interfacial impedance at high potentials. The plasma-sputtered gold layer on this hardware ensures superior electrical conductivity and electrochemical passivity, guaranteeing that your experimental data reflects true electrode kinetics rather than hardware degradation.
- Precision-Calibrated Stack Pressure: Maintaining constant, uniform mechanical compression is critical for cell performance, especially during volumetric changes in high-capacity anodes and solid-state systems. The precision-engineered wave and conical springs ensure reproducible axial load distribution without crushing delicate separator membranes or active material coatings.
- Hermetic Environmental Isolation: The high-integrity polypropylene seal combined with accurately stamped 304 stainless steel cases prevents solvent evaporation and atmospheric ingress (H2O, O2). This ensures long-term cycling stability even during extended high-temperature testing protocols.
- Adaptable Customization Capabilities: While standard gold plating meets the most rigorous research demands, our manufacturing process readily supports specialized functional coatings such as aluminum, platinum, and silver to accommodate specialized working potentials and research parameters.
Contact our technical sales team today to request a quotation, inquire about volume pricing, or discuss customized plating and dimensional specifications for your laboratory workflow.
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Product Datasheet
Gold Plated 304SS Stainless Steel 2032 Coin Cell Cases with Spacers and Wave Springs
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