The primary purpose of using heating plates and jigs during the preheating process is to prepare copper paste for successful bonding by strictly controlling the environment prior to high-temperature sintering.
Specifically, this equipment is used to manage the evaporation of moisture and the thermal degradation of additives. By regulating these factors early, you prevent the formation of structural defects and ensure the copper surface is chemically pure enough to bond.
Core Insight Preheating is not merely a warm-up step; it is a purification and stabilization phase. Its function is to eliminate volatile components and strip oxidation layers, creating the specific chemical and physical conditions required for a high-density, defect-free sintered joint.
The Mechanics of Defect Prevention
Controlling Moisture Evaporation
Copper paste often contains moisture that, if heated too rapidly during the main sintering phase, can turn to steam explosively.
Heating plates provide a controlled thermal ramp. This allows moisture to evaporate gradually rather than boiling off violently.
Eliminating Pore Defects
The direct result of uncontrolled moisture evaporation is the formation of pore defects (voids) within the material.
By using jigs and plates to stabilize the preheating phase, you ensure the residual moisture is removed completely. This prevents gas pockets from becoming trapped inside the hardening copper, which is essential for structural integrity.
Ensuring Surface Purity
Activating the Chemical Cleaners
Copper surfaces naturally develop an oxide layer that prevents effective sintering.
The preheating process creates a specific temperature window required by the "activator" components within the paste.
Removing the Oxide Layer
Once the correct temperature is reached, the activator functions to chemically remove the oxide layer from the copper.
This ensures that the copper chips retain high purity. Without this step, the sintering process would attempt to bond oxidized surfaces, leading to weak electrical and thermal connections.
Managing Additive Degradation
Copper pastes contain various additives that must be removed or broken down before the final bond forms.
Heating plates facilitate the thermal degradation of these specific additives at the correct rate. This clears the way for pure copper-to-copper contact during the formal sintering stage.
Understanding the Risks
The "Window" of Effectiveness
The process relies on hitting a precise temperature window.
If the temperature is too low, the activator will not trigger, leaving oxides on the surface. If the temperature is too high or applied too fast, the solvent evaporation may be too aggressive, causing cracks or voids despite the preheating efforts.
Equipment Dependence
Success is highly dependent on the uniformity of the heating plates and the fit of the specific jigs.
Inconsistent contact between the jig and the heating source can lead to uneven drying. This results in localized defects where some areas are ready for sintering while others still contain moisture or oxides.
Making the Right Choice for Your Goal
To optimize your copper sintering process, align your preheating strategy with your specific quality metrics:
- If your primary focus is Structural Integrity: Prioritize the rate of moisture evaporation to prevent pore defects; ensure your heating profile is slow enough to allow full outgassing.
- If your primary focus is Electrical Conductivity: Focus on the activator temperature window; ensure the preheat stage is hot enough to fully engage the activator and strip all oxides from the copper surface.
Effective preheating transforms a volatile paste into a stable, pure material ready for high-performance bonding.
Summary Table:
| Process Phase | Key Function | Primary Outcome |
|---|---|---|
| Moisture Control | Gradual evaporation via heating plates | Prevents explosive steaming and pore defects (voids) |
| Surface Purification | Activator engagement at precise temperature | Removes copper oxide layers for high-purity bonding |
| Additive Management | Regulated thermal degradation | Ensures clean copper-to-copper contact for conductivity |
| Process Stability | Uniform heating through precision jigs | Eliminates localized defects and inconsistent outgassing |
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References
- Gun‐woo Park, Keon‐Soo Jang. Effect of Molecular Weight of Poly(Acrylic Acid) as an Activator on Cu Sintering Performances. DOI: 10.1002/app.57200
This article is also based on technical information from Kintek Press Knowledge Base .
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