Products Laboratory Press Machine Vacuum Heated Lab Press 60-Ton Automatic Vacuum Hot Press for High-Density Material Consolidation
60-Ton Automatic Vacuum Hot Press for High-Density Material Consolidation

Vacuum Heated Lab Press

60-Ton Automatic Vacuum Hot Press for High-Density Material Consolidation

Item Number : XP19

Price varies based on specs and customizations


Maximum Force
≤ 60.0 Tons
Active Pressure
~305.6 MPa
Maximum Temperature
500°C
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Product Overview

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This automatic vacuum hot press system represents a milestone in high-pressure, high-temperature material consolidation. By seamlessly integrating a 60-ton servo-controlled hydraulic press, a -0.1 MPa mechanical vacuum chamber, and an advanced Tungsten Carbide heating mold, it delivers continuous compaction pressures up to 305.6 MPa on 50 mm diameter specimens. This extreme pressure regime, combined with programmable PID temperature control up to 500°C, enables researchers to achieve near-theoretical densities for the most challenging materials—a capability that sets a new benchmark for laboratory-scale powder consolidation.

The equipment is engineered for a wide spectrum of demanding applications. Primary use cases include battery R&D (solid-state electrolytes, cathode/electrode composites), advanced powder metallurgy (tungsten carbide, borides, cermets), high-performance polymer densification (PEEK, PI films), and diffusion bonding of dissimilar materials. Its fully automated, multi-stage recipe management eliminates manual intervention, ensuring that every sample is processed under identical, repeatable conditions—essential for both academic research and pilot production.

Constructed from heavy-duty industrial components and protected by triple hardware interlocks, this unit is designed for continuous, reliable service in rigorous laboratory environments. With CE certification, rapid water cooling, and a user-friendly 7-inch touchscreen HMI, it not only delivers performance but also peace of mind. For institutions that demand the utmost in sample density, process consistency, and operational safety, this system is a strategic investment in materials science advancement.

Key Features

  • Ultra‑High Compaction Pressure (305.6 MPa): By applying 60 tons of force onto a 50‑mm diameter mold, this press generates pressures far exceeding conventional lab systems. This enables the consolidation of notoriously hard‑to‑densify materials such as refractory metal powders, ultra‑high molecular weight polymers, and ceramic‑metal composites to near‑theoretical density in a single step.
  • Tungsten Carbide Mold System: The core of the system is a precision‑engineered WC mold that maintains compressive strength above 2000 MPa and dimensional stability at 500°C. Unlike standard tool steel molds that warp and degrade, this mold ensures consistent sample geometry over hundreds of cycles, reducing per‑sample cost and eliminating quality deviations.
  • Advanced Multi‑Segment PID Automation: The 7‑inch industrial touchscreen HMI enables dual‑axis programming of pressure and temperature with up to 50 stored recipes. Closed‑loop control automatically executes ramping, dwell, and release phases, maintaining pressure within tight tolerances during extended runs—critical for diffusion bonding and sintering processes.
  • Integrated Mechanical Vacuum (≤ ‑0.1 MPa): A robust mechanical pump evacuates the chamber, removing air and volatile by‑products that cause oxidation or porosity. This is essential when processing oxygen‑sensitive materials like titanium alloys, solid‑state electrolytes, or high‑temperature thermoplastics, and operates reliably without expensive turbo‑molecular pumps.
  • Triple Active Safety Interlocks: The safety architecture includes (a) a door limit switch that instantly halts motion and heating upon opening, (b) a pressure transducer with hydraulic relief valve that prevents overloading beyond 60 tons, and (c) a thermal cutoff that disconnects power if temperature exceeds 500°C. These hardware‑based protections act independently of the control software, guaranteeing fail‑safe operation.
  • External Closed‑Loop Cooling System: A dedicated water chiller circulates coolant through the mold and hydraulic circuit, rapidly dissipating heat after high‑temperature runs. This reduces cycle turnaround times, protects seals and electronics from thermal fatigue, and extends the overall lifespan of the system.
  • Heavy‑Duty Frame & Vacuum Vessel: The press frame and vacuum chamber are fabricated from thick‑section high‑strength steel, engineered to resist the combined mechanical and vacuum loads without deflection. This rigidity maintains mold parallelism under full load, preventing sample wedge distortion and ensuring uniform pressure distribution.
  • Uniform Stress Distribution Design: Precision‑machined platens and an integrated mold guidance system ensure that pressure is evenly distributed across the sample surface. This feature mitigates localized stress concentrations, reducing the risk of cracking and maximizing densification homogeneity.
  • Stored Recipe Management: With storage for up to 50 user‑defined pressure‑temperature programs, operators can switch between different material processes in seconds. This simplifies workflow, reduces setup errors, and accelerates R&D iteration rates.
  • CE Certified & Globally Supported: The system complies with rigorous European safety and performance standards. KINTEK’s worldwide network provides installation, training, and responsive after‑sales support, ensuring maximum uptime and productivity.

Applications

Application Description Key Benefit
High‑Performance Thermoplastics Vacuum hot pressing of PEEK, PEI, PPS, and PI films or powders to eliminate micro‑bubbles and voids. Produces fully dense polymer components with superior chemical resistance, mechanical strength, and thermal stability for aerospace and medical implants.
Powder Metallurgy & Hard Metals Ultra‑high pressure sintering of WC‑Co, borides, and cermets to achieve high green density. Near‑theoretical density parts with exceptional hardness, wear resistance, and fine grain structure, ideal for cutting tools and wear parts.
Diffusion Bonding / Diffusion Welding Solid‑state joining of dissimilar metals (Cu/Al, steel/ceramic) under high pressure and temperature without filler. Creates void‑free, high‑strength joints with pristine interfaces, essential for microelectronics, optical assemblies, and nuclear reactor components.
Battery Electrode & Solid‑State Electrolytes Densification of LLZO, LATP, and composite cathode/electrolyte layers for all‑solid‑state batteries. Enhances ionic conductivity and mechanical integrity by eliminating interfacial voids, a critical requirement for next‑gen battery performance and safety.
Functional Ceramics Sintering of piezoelectric (PZT), dielectric (BaTiO₃), and ferrite powders under vacuum to maintain stoichiometry and purity. Maximizes electromechanical properties by achieving full density without organic contaminants or porosity, vital for advanced sensors and actuators.
Metal Matrix Composites (MMCs) Infiltration and hot pressing of aluminum or titanium matrices reinforced with SiC, Al₂O₃, or carbon fibers. Uniform particle distribution and full consolidation, improving specific strength, stiffness, and thermal conductivity for lightweight structural applications.
Sputtering Targets & Thin Film Precursors Consolidation of high‑purity metal or oxide powders into target blanks for physical vapor deposition (PVD). Achieves full density and fine grain structure, ensuring uniform thin film deposition and extended target lifetime in semiconductor manufacturing.
Carbon‑Carbon Composites Vacuum hot pressing of carbon fiber preforms with pitch or resin matrix to create high‑density C/C composites. Achieves uniform densification with exceptional thermal and mechanical properties for aerospace, braking, and thermal management applications.
Additive Manufacturing (AM) Post‑Processing Densification of additively manufactured metal or ceramic parts to eliminate internal porosity. Transforms low‑density AM prototypes into functional, fully dense components with improved fatigue life, strength, and surface finish.

Technical Specifications

The following tables detail the core physical, performance, and safety specifications of the XP19 system.

Physical & Performance Specifications

Parameter Specification
Model Number XP19
Max Force ≤ 60.0 Tons (approx. 600 kN), auto‑controlled
Active Pressure (on 50 mm mold) ~305.6 MPa
Mold Material Tungsten Carbide (WC)
Mold Dimensions Diameter: Φ 50 mm, Filling Height: 15 mm
Temperature Range RT to 500°C, PID programmable
Vacuum Level ≤ -0.1 MPa (mechanical vacuum)
Cooling System Closed‑loop water circulation (external chiller)
Power Supply AC 220 V / 50 Hz, single phase
Certification CE Certified

Safety Interlock System

Interlock Mechanism Protection Logic Lab Safety Value
Door Limit Detection Front door open triggers limit switch, cutting heating and pressurization instantly. Prevents accidental contact with hot/pressurized zone, avoiding burns or crush injuries.
Pressure Overload Trip Precision sensor detects overload >60 T; main relief valve opens and alarm sounds. Protects the Tungsten Carbide mold from catastrophic failure due to over‑pressure.
Thermal Runaway Fuse Dual‑redundant temperature monitoring; power cut if temperature exceeds 500°C. Eliminates risk of thermal runaway, preserving vacuum chamber and sample integrity.

Why Choose This Product

  • Pioneering Pressure Capability: With 305.6 MPa continuous compaction, this system outperforms typical laboratory hot presses by an order of magnitude. It opens up entirely new processing windows for refractory materials, advanced ceramics, and nanocomposites, enabling research that would be impossible on standard equipment.
  • Premium, Long‑Life Tooling: The included Tungsten Carbide mold is not a consumable—it is a precision‑engineered asset designed for hundreds of cycles. Its dimensional stability at high temperatures eliminates the hidden costs and inconsistencies of frequent mold replacements, delivering a lower total cost of ownership.
  • Intelligent Automation for Repeatability: The dual‑axis PID controller with extensive recipe storage allows even novice operators to reproduce exact processing conditions with a single touch. This minimizes human error and ensures that published results are consistently reproducible across projects and research teams.
  • Uncompromising Safety Architecture: Three independent hardware interlocks provide maximum protection for both personnel and equipment. Features like automatic pressure relief and thermal fuses enable safe unattended overnight operation, a critical advantage in high‑throughput labs.
  • Scalable & Customizable Platform: From R&D to pilot production, this press adapts to evolving requirements. Custom mold geometries, gas handling kits, and software integrations are available. Backed by KINTEK’s lifetime technical support and rapid spare parts supply, it is a future‑proof investment. Contact us today to discuss your specific consolidation challenges and receive a tailored quotation.

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Product Datasheet

60-Ton Automatic Vacuum Hot Press for High-Density Material Consolidation

Category Catalog

Vacuum Heated Lab Press


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