Vacuum Heated Lab Press
30T Electric Vacuum Hot Press
Item Number : XP23
Price varies based on specs and customizations
- Maximum Working Force
- 30 Tons (300 kN)
- Working Temperature
- Up to 300 °C
- Platen Dimensions
- 400 × 400 mm
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Product Overview


This electric vacuum hot press integrates precise temperature control, programmable pressure profiles, and a sealed inert-atmosphere chamber into a compact laboratory system. It is purpose-built for materials scientists developing next-generation energy storage, advanced composites, and functional ceramics. The equipment combines heating up to 300°C with a maximum pressing force of 30 tons, enabling reliable thermo-compression bonding, lamination, and densification under clean, oxygen-free conditions.
Primary applications include fabrication of battery electrodes, solid-state electrolytes, and multilayer components where oxidation or contamination compromises performance. The system’s active cooling design drastically shortens cycle times, making it suitable for both iterative R&D and small-batch production. Safety interlocks on the chamber door and over-temperature protection ensure operator safety during unattended runs.
Engineered with a robust SUS 304 stainless steel chamber and driven by an industrial PLC with intuitive touchscreen, this unit delivers consistent, repeatable results day after day. Its proven design and rigorous manufacturing ensure minimal downtime, even under demanding high-temperature, high-pressure cycling.
Key Features
- Vacuum & Protective Atmosphere Chamber: The heavy-gauge SUS 304 stainless steel chamber is machined and welded to high vacuum standards, enabling evacuation to -0.1 MPa. Dual gas inlets allow controlled purging with nitrogen or argon, creating an inert micro-environment that prevents oxidation of sensitive samples during the entire thermal cycle. The chamber is leak-tested for minimal outgassing, with check valves to prevent backflow.
- Precise Temperature Uniformity: Dual platens are heated by embedded elements with a combined rating of 5.6 kW, achieving rapid heating at 2–5°C/min and maintaining surface uniformity across the 400×400 mm area. A dedicated PID algorithm ensures the temperature setpoint is held within tight tolerances, critical for reproducible material properties.
- Integrated Active Cooling: Internal water channels machined into both platens enable forced cooling immediately after the soak phase, dramatically reducing cool-down time. When connected to an external recirculating chiller (≥1.5 HP), the system can cycle from 300°C to near-ambient in minutes, boosting daily sample throughput and avoiding thermal shock.
- Programmable Multi-Step Recipes: The industrial HMI touchscreen controller supports synchronized temperature-pressure sequences. Operators can program ramps, dwells, and transitions—e.g., heat to 200°C, apply 20 tons for 10 minutes, then ramp down force while holding temperature—and visualize the process with real-time dual-plot graphs. All recipe and process data can be exported via USB for QA/QC traceability.
- High-Force Precision Pressing: A closed-loop hydraulic system, controlled through the PLC, delivers up to 30 tons (300 kN) with excellent repeatability. This precision ensures consistent bonding pressure across the entire platen area, preventing material waste and rework.
- Robust, Low-Maintenance Construction: The press frame and chamber are fabricated entirely from SUS 304 stainless steel, offering superior corrosion resistance and durability. Precision-ground platens and high-quality seals minimize maintenance requirements and extend service life even under continuous operation.
- Flexible Facility Integration: Standard interfaces for vacuum pump, gas supply, and cooling water simplify connection to existing lab utilities. A single-phase 220V power input is standard, with an optional 380V three-phase configuration available for high-throughput settings.
Applications
| Application | Description | Key Benefit |
|---|---|---|
| Lithium-Ion Battery Electrode Pressing | Hot-pressing of cathode and anode films onto current collectors to improve interfacial adhesion and electrode density. | Uniform pressure and temperature eliminate delamination and reduce internal resistance, increasing cell performance. |
| Solid-State Battery Electrolyte Densification | Compaction of sulfide or oxide solid electrolytes under argon atmosphere to achieve high ionic conductivity without moisture contamination. | Inert environment preserves phase purity and ionic transport properties. |
| Advanced Composite Lamination | Multi-layer bonding of prepregs, thermoplastic films, or carbon fiber sheets for aerospace and automotive prototypes. | Programmable pressure and cooling ensure void-free laminates with consistent thickness. |
| Technical Ceramic Sintering | Pressure-assisted sintering of alumina, zirconia, or silicon nitride substrates under vacuum to remove binders and achieve full density. | Combination of vacuum extraction and precise thermal profiling yields defect-free ceramic parts. |
| Metal Matrix Composite (MMC) Fabrication | Warm pressing of metal powders (e.g., Al, Cu) reinforced with ceramic particles for thermal management or wear-resistant components. | Fast cooling after pressing limits grain growth, enhancing mechanical and thermal properties. |
| Hot Embossing of Polymer Films | Micro-structuring of thermoplastic films for microfluidic devices or optical components using heated plates and controlled force. | Accurate force and temperature control replicate fine features with high fidelity. |
| Thin-Film Laminate Sealing | Laminating barrier films for OLED or organic photovoltaic encapsulation in a moisture-free, oxygen-free environment. | Inert atmosphere prevents oxidation of sensitive organic layers during bonding. |
| R&D Material Synthesis | Exploring new material formulations and bonding processes with flexible recipe definition and comprehensive data logging. | Rapid iteration and data export accelerate material discovery and process scale-up. |
Technical Specifications
The following table details the technical specifications of the XP23 electric vacuum hot press.
| System Subassembly | Parameter Description | Technical Standard |
|---|---|---|
| Model | – | XP23 |
| Pressure System | Maximum Working Force | 0 – 30 Tons (0 – 300 kN) |
| Pressure System | Platen Dimensions | 400 × 400 mm |
| Pressure System | Pressure Controller | Programmable Touchscreen PLC |
| Thermal System | Working Temperature | Ambient – 300 °C |
| Thermal System | Heating Power | 5600 W (5.6 kW) |
| Thermal System | Heating Rate | 2 – 5 °C / min |
| Thermal System | Temperature Controller | Programmable Touchscreen PLC |
| Thermal System | Platen Cooling Method | Circulating Water Cooling (internal channels) |
| Environment Control | Vacuum Level | -0.1 MPa (rough vacuum configuration) |
| Environment Control | Vacuum Chamber Material | SUS 304 Stainless Steel |
| Environment Control | Process Atmosphere | Nitrogen (N₂) / Argon (Ar) Inert Gases |
| Facility & Utility | Power Supply | AC 220V / 50Hz (380V 3-Phase optional upon request) |
| Facility & Utility | Dimensions (Chamber & Control Cabinet) | 550 × 600 × 850 mm |
Process Control & Software
The industrial HMI offers comprehensive recipe management. Operators can define multi-stage cycles: for example, heat to a specified temperature, then incrementally apply pressure while holding temperature, release pressure but maintain heat for annealing, and finally trigger active cooling. The system plots temperature and pressure in real time on dual curves, allowing instant assessment of process fidelity. All process data, including historical logs, can be exported to USB for analysis and traceability, meeting modern QA/QC requirements.
Supporting Utilities: To ensure flawless installation, please prepare the following external utilities prior to delivery:
- Cooling Source: External water chiller (≥1.5 HP, flow rate ≥15 L/min) for platens cooling.
- Vacuum Source: External vacuum pump (dual-stage rotary vane or dry scroll, displacement ≥4 L/s).
- Gas Supply: N₂/Ar cylinders with pressure regulator (recommended input 0.1–0.2 MPa).
Why Choose This Product
- Built to Last: The all-SUS 304 stainless steel construction resists corrosion and deformation, ensuring dimensional stability and reliable performance for decades. Rigorous factory testing of every chamber, platen, and seal guarantees that your press arrives ready for production-quality work.
- Uncompromised Process Precision: The integrated PID temperature controller and closed-loop pressure system maintain process variables within tight limits, run after run. Whether you are bonding delicate battery films or densifying technical ceramics, this vacuum hot press delivers consistent material properties.
- Productivity-Enhancing Design: Features such as active water cooling and programmable automatic sequences minimize idle time and operator intervention. The large 400×400 mm platen accommodates multiple samples or larger components, boosting throughput without sacrificing uniformity.
- World-Class Support: KINTEK’s global service network offers lifetime technical consultation, rapid spare parts delivery, and application support. Our engineers are available to assist with installation, training, and process development, ensuring you maximize the value of your investment.
- Customization Capabilities: Beyond standard configurations, we offer tailored platen materials, pressure ranges, and interface options to meet unique process requirements. Contact our team to explore how we can adapt this system into a fully bespoke solution for your laboratory.
Contact us today to request a quote or discuss custom configurations tailored to your specific process requirements.
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