Vacuum Heated Lab Press
40 Ton 400x400mm Vacuum Hot Press with Independent Temperature and Pressure Control
Item Number : XP24
Price varies based on specs and customizations
- Maximum Working Pressure
- 0–40 Tons (0–400 kN)
- Effective Platen Size
- 400 × 400 mm
- Temperature Range
- Room temperature to 300°C
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Product Overview
This system is a precision vacuum hot press engineered for high-pressure, high-temperature material consolidation in a controlled environment. With a maximum force of 40 tons over a 400×400 mm platen area and vacuum capability down to -0.1 MPa, it delivers exceptional parallelism and pressure uniformity. The integrated heating and vacuum chamber enable advanced processing of air-sensitive materials that require contamination-free conditions.
Ideal for research laboratories and pilot production, this equipment is widely used in battery electrode densification, solid-state electrolyte lamination, ceramic composite sintering, and polymer molding. Its ability to independently program temperature rise and hydraulic loading ensures that materials are subjected to compression only at optimal thermal states, preventing early-stage shear damage.
Engineered for durability, the 600 kg rigid closed-loop frame limits elastic deformation to micron levels, even under full load. Paired with industrial-grade 380V balanced heating, thermal barriers, and a polished stainless steel vacuum chamber, this unit guarantees long-term repeatability and safe operation in demanding, round-the-clock environments.
Key Features
- Rigid Four-Column Load Frame: The massive 600 kg welded structure employs a closed-loop design that counteracts the 400 kN reaction force, maintaining platen parallelism within tight tolerances and ensuring micron-level frame deflection for uniform pressure distribution across the entire 400×400 mm area.
- Symmetrical Matrix Heating: A 5.5 kW heating system with 380V 3-phase power distributes heating elements in a uniform matrix across the platens, minimizing thermal gradients and hot spots—critical for achieving consistent part quality in temperature-sensitive processes.
- High-Vacuum Stainless Steel Chamber: Fabricated from thick-walled SUS304 stainless steel with mirror-polished internal surfaces, the chamber is leak-tested using pressure and helium mass spectrometry, providing a static vacuum down to -0.1 MPa to evacuate volatiles and prevent oxidation.
- Dual Gas Port with Micro-Adjustment: After evacuation, controlled flows of N₂ or Ar can be introduced via precision metering valves, creating a protective inert atmosphere for sensitive materials such as lithium compounds or high-temperature alloys.
- Independent Temperature-Pressure Profiling: Operators can decouple thermal ramps from hydraulic loading, programming temperature setpoints before initiating compression; this prevents premature shear stress on materials at their softening or phase-transition points, enhancing densification uniformity.
- Integrated Water Cooling Circuits: Built-in straight-through cooling channels in the platens allow rapid heat dissipation upon cycle completion; this not only shortens turn-around time but also protects heating elements from long-term drift due to excessive thermal soak.
- Thermal Isolation Barriers: Insulator plates positioned between the heated platens and the hydraulic actuator protect seals and components from sustained high temperatures, extending service intervals and ensuring reliable actuation.
- Industrial Electrical Integration: The system requires a 380V 50Hz 3-phase supply, recommended 16A breaker, and proper grounding; it is designed for robust industrial environments with compliance to standard electrical codes.
Applications
| Application | Description | Key Benefit |
|---|---|---|
| Li-Ion Battery Electrode Densification | Vacuum hot pressing of cathode/anode films (e.g., NMC, LFP) to achieve target porosity and enhance electrical conductivity. | Uniform compaction force eliminates density gradients, boosting energy density and cycle life. |
| Solid-State Battery Layer Lamination | Laminating electrolyte separators with lithium metal anodes under vacuum to avoid interfacial voids and oxidation. | Ultra-clean bonding interfaces ensure low ionic resistance and superior cell safety. |
| Advanced Ceramic Sintering | Pressure-assisted densification of engineering ceramics (alumina, zirconia, silicon carbide) at high temperature in vacuum or inert gas. | Reaches near-theoretical density with fine grain structure, enhancing mechanical strength and wear resistance. |
| Powder Metallurgy Compaction | Compressing metal or alloy powders into near-net shape preforms with reduced porosity, followed by sintering. | High green density leads to improved material homogeneity and less shrinkage during sintering. |
| CFRP and Composite Molding | Curing carbon fiber reinforced prepregs under heat and pressure while vacuum evacuates air to eliminate delamination. | Lightweight structural parts with minimal void content for aerospace and automotive applications. |
| Microfluidic Chip Fabrication | Hot embossing of thermoplastic substrates (PMMA, COC) using precision-machined molds under vacuum for bubble-free replication. | High-fidelity feature transfer down to micron dimensions, essential for lab-on-a-chip devices. |
| Sputtering Target Bonding | Bonding indium or other bond layers between target material and backing plate under controlled heat and pressure in vacuum. | High bond integrity and thermal conductivity for reliable thin-film deposition runs. |
| High-Performance Polymer Processing | Compression molding of PEEK, PEKK, and other high-temp thermoplastics under vacuum to prevent oxidative degradation. | Consistent mechanical properties and surface finish for demanding medical or semiconductor components. |
Technical Specifications
| Module | Parameter | Specification |
|---|---|---|
| General | Model | XP24 |
| Force | Maximum Working Pressure | 0–40 Tons (0–400 kN), continuously adjustable via hydraulic precision pressure control |
| Effective Platen Area | 400 × 400 mm | |
| Platen Surface Flatness | ≤ 0.05 mm across entire surface | |
| Load Frame Design | Rigid four-column closed-loop frame, net weight 600 kg, minimal elastic deformation at full load | |
| Thermal | Temperature Range | Room temperature to 300°C (maximum design temperature 320°C) |
| Heating Power | 5.5 kW (5500 W), 380V 3-phase, resistive heating element matrix | |
| Heating Rate | 2–5°C/min, dependent on tooling and sample thermal mass | |
| Cooling System | Integrated dual water-cooling channels in platens; requires external chiller (recommended capacity ≥2.0 kW, 15–25°C water) | |
| Thermal Protection | Insulator barriers between heated platens and hydraulics prevent heat migration | |
| Vacuum & Atmosphere | Chamber Material | SUS304 stainless steel, thick-walled, internal mirror polish for low outgassing |
| Vacuum Level | Static vacuum down to -0.1 MPa (approx. 10 Pa) via external vacuum pump | |
| Leak Detection | High-pressure nitrogen and helium mass spectrometer tested for chamber integrity | |
| Gas Supply | Dual independent channels for N₂/Ar with precision micro-flow control and safety exhaust valve | |
| Utility & Installation | Power Requirement | AC 380V, 50Hz, 3-phase + neutral + PE (5-wire); recommended circuit breaker 16A, 3P+N+PE with leakage protection; cable cross-section ≥4 mm² copper |
| Vacuum Pump Requirement | External pump with displacement ≥4 L/s, oil-mist filter or dry scroll type recommended | |
| External Dimensions (W×D×H) | 900 × 850 × 1300 mm (floor-standing, require solid, level concrete floor) | |
| Net Weight | Approx. 600 kg | |
| Cooling Water Interface | Quick-connect fittings for external chiller connection |
Why Choose This Product
- Ultimate Parallelism Under Load: The 600 kg rigid frame minimizes frame splay, maintaining platen parallelism within tight tolerances even at 40 tons—essential for large-format pressing where edge-to-edge uniformity dictates part quality.
- Thermal Uniformity for Repeatability: Matrix heater layout eliminates hot spots, while integrated water cooling accelerates cycle times and preserves heater element accuracy, enabling high-throughput research without drift.
- Contamination-Free Processing: The polished SUS304 vacuum chamber and -0.1 MPa capability, combined with dual gas inlets, provide a pristine environment for oxidation-sensitive or outgas-prone materials, reducing rejects.
- Purpose-Built for Industrial Labs: Designed for 380V three-phase operation with robust circuit protection and thermal safety barriers, this system meets the high-duty cycles of professional development environments.
- Flexible Process Programming: Decoupled temperature and pressure profiles let you mimic complex material behavior during sintering or lamination, ensuring optimal densification at the right thermal window.
Contact our team to configure a vacuum hot press solution matched to your process requirements and receive a customized quotation.
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