Laboratory Heated Press
Automatic High Pressure Hot Press 90 Ton 300x300mm Platens 0.2% Pressure Accuracy 200C
Item Number : XP65
Price varies based on specs and customizations
- Max Force
- 0 - 90 Tons (900 kN)
- Platen Size
- 300 × 300 mm
- Pressure Sensor Accuracy
- ±0.2%
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Product Overview

This automatic high-pressure hot press is a high-performance benchtop system designed for applications demanding extreme clamping force and precise thermal management. With a maximum output of 90 tons across 300×300 mm platens, it achieves surface pressures up to 100 Bar (10 MPa), enabling dense compaction and reliable bonding of advanced materials. The integrated PIDS closed-loop pressure control and independent dual-zone heating ensure exceptional process stability and repeatability.
Ideal for R&D and pilot production, this unit serves the battery, semiconductor, polymer, and composite industries. Common uses include solid-state battery lamination, semiconductor packaging, polymer molding, and composite densification, where uniform pressure and temperature profiles are critical for material performance.
Built on a 350 kg solid steel frame, the press maintains structural integrity and precise alignment under full load. Its robust hydraulic system and thermal management have been engineered for sustained operation in demanding laboratory and industrial environments, delivering consistent results over thousands of cycles. Its low-noise hydraulic pump and high energy efficiency make it suitable for 24/7 production.
Key Features
This system includes the following advanced features to deliver precision, reliability, and safety:
- 90-Ton Maximum Force with Uniform Distribution: Delivers up to 90 tons (900 kN) across 300×300 mm platens, generating surface pressures of approximately 100 Bar (10 MPa). The force is applied uniformly via a precision-ground hydraulic cylinder and PIDS algorithm, ensuring even compaction across the entire platen area.
- Precision Closed-Loop Pressure Control: A proprietary PIDS control system with a ±0.2% high-accuracy pressure sensor maintains the set force within tight tolerances, eliminating drift during long holds. This closed-loop feedback mechanism automatically adjusts hydraulic pressure to compensate for material relaxation.
- Intuitive 7-Inch Touchscreen Interface: All process parameters are managed via a color touchscreen, supporting multi-step pressure and temperature programming. Users can create, store, and recall up to 20 custom recipes, enabling one-touch automated cycles and simplified workflow management.
- Independent Dual-Zone PID Heating: Upper and lower platens feature independent PID temperature controllers, providing precise thermal regulation from ambient to 200°C. The platens are optimized for thermal symmetry and flatness, minimizing temperature gradients and preventing overshoot.
- Robust 350 kg Solid Steel Frame: The high-density steel frame weighs 350 kg, providing exceptional rigidity and minimal deflection even at 90 tons. This compact design (600×520×650 mm) ensures long-term dimensional stability and easily fits on standard lab benches.
- Efficient 3500 W Heating System: Total heating power of 3500 W enables rapid warm-up and recovery, while low-loss insulation maintains temperature uniformity. The system reaches setpoint quickly and holds it with minimal energy consumption.
- Programmable Multi-Stage Profiles: Up to 10 segments per recipe allow complex pressure and temperature ramps/dwells, facilitating sophisticated processing for temperature- and pressure-sensitive materials.
- Integrated Safety Protections: Over-temperature and over-pressure limits, emergency stop, and thermal fuses prevent unsafe conditions. A dedicated 16A circuit ensures reliable power delivery without overload.
- Low-Maintenance Hydraulic System: Sealed hydraulic circuit with high-quality valves and a quiet pump reduces maintenance needs. The system includes oil level and filter condition indicators for easy service.
- Versatile Platen Configurations: Standard 300×300 mm platens can be customized with cooling channels, vacuum ports, or interchangeable surfaces to accommodate special tooling or specific material requirements.
Applications
This press is utilized across a variety of industries and processes:
| Application | Description | Key Benefit |
|---|---|---|
| Solid-State Battery Lamination | Compacts electrode and solid electrolyte layers under high pressure to reduce interfacial resistance, improving ionic conductivity and cell performance. Multi-step pressure profiles allow optimized lamination cycles without damaging delicate materials. | Achieves defect-free interfaces with 90-ton force. |
| Semiconductor Packaging | Performs precision thermal compression bonding of large-format substrates, dies, or encapsulation materials at controlled temperatures up to 200°C. Uniform pressure ensures reliable, void-free bonds, critical for advanced packaging technologies. | Consistent bond integrity and planarity. |
| Polymer Molding | Molds and cures engineering plastics, PTFE, polyethylene, and rubber sheets under high clamp force and constant heat. Programmable cycles ensure repeatable part quality and dimensional accuracy. | High-density, dimensionally accurate parts. |
| Composite Densification | Consolidates fiber-reinforced composites, prepregs, and laminates using multi-stage heat and pressure profiles to eliminate voids and increase fiber volume fraction. | Enhanced mechanical strength and durability. |
| Ceramic Substrate Lamination | Presses multilayer ceramic green tapes for LTCC/HTCC modules, ensuring uniform thickness and adhesion. The even pressure distribution prevents cracking and delamination. | High-yield production of reliable substrates. |
| Fuel Cell MEA Assembly | Hot presses membrane electrode assemblies for PEM fuel cells, bonding the catalyst layers to the membrane under precise temperature and pressure to optimize the three-phase boundary. | Optimized performance and durability. |
| Sputtering Target Bonding | Bonds sputtering targets to backing plates using high pressure and heat, ensuring a strong, conductive interface that withstands thermal cycling. | Reliable bond without voids or hot spots. |
| Adhesive Lamination | Cures structural adhesives between dissimilar materials, such as metal and glass, for optical or aerospace components, using controlled force and heat. | Strong, optically clear bonds with no bubbles. |
Technical Specifications
The following table details all technical parameters of the XP65-90T3030 system:
| Parameter | Specification | Remarks |
|---|---|---|
| Model | XP65-90T3030 | High-pressure automatic hot press |
| Max Force | 0 - 90 Tons (900 kN) | PIDS closed-loop hydraulic control for stable force application |
| Pressure Sensor Accuracy | ±0.2% | High-precision sensor ensures minimal pressure drift |
| Working Temperature | 0 - 200 °C (Max 200°C) | Optimized for thermal symmetry and flatness up to 200°C |
| Temperature Control | PID programmable controller | 7-inch color touchscreen interface for multi-step programming |
| Heating Power | 3500 W | Efficient heating with low thermal loss |
| Platen Size | 300 × 300 mm | Suitable for samples up to 300×300 mm |
| Max Surface Pressure | ~100 Bar (10 MPa) | Achieved at 90 tons across full platen area |
| Power Supply | AC 220V / 50Hz (single phase) | Requires dedicated 16A circuit for safe operation |
| Dimensions (W×D×H) | 600 × 520 × 650 mm | Compact benchtop footprint |
| Weight | 350 kg | Heavy-duty construction for rigidity; ensure bench supports |
Why Choose This Product
- Built for Long-Term Reliability: The 350 kg solid steel frame and industrial-grade hydraulic components are designed to withstand continuous operation at maximum load, providing years of trouble-free service. Precision machining of platens and guide rods ensures consistent alignment and minimal wear over thousands of cycles.
- Advanced Process Control: With PIDS closed-loop pressure regulation and independent dual-zone PID heating, this press delivers unmatched temperature and pressure stability. This precision reduces part variability and enhances yield, making it ideal for critical R&D and pilot production.
- Space-Efficient Heavy-Duty Design: Despite its 90-ton capacity, the press has a compact footprint of just 600×520 mm, occupying minimal lab space. Its low-profile, heavy base provides stability without the need for bolting to the floor, simplifying installation.
- Flexible and User-Friendly: The intuitive touchscreen and multi-step programming allow rapid recipe development and easy operator training. Stored recipes and quick-change platens facilitate fast transitions between different materials and processes, maximizing productivity.
- Comprehensive Support and Customization: Backed by KINTEK’s global service network, this press is supported from installation through lifecycle. Custom engineering services are available for specialized tooling, automation integration, or unique process requirements, ensuring it meets your exact needs.
Experience the difference in precision and durability—contact our team today for a detailed quote or to discuss how this system can be tailored to your specific application. We provide comprehensive documentation and training to ensure seamless integration into your workflow.
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Product Datasheet
Automatic High Pressure Hot Press 90 Ton 300x300mm Platens 0.2% Pressure Accuracy 200C
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