Vacuum Heated Lab Press
10T Vacuum Automatic Hot Press for Precision Lab Pressing
Item Number : XP32
Price varies based on specs and customizations
- Max Working Pressure
- 10 Tons
- Platen Working Temperature
- Room Temp – 300 °C
- Platen Dimensions
- 200 mm × 200 mm
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Product Overview
This benchtop hot press integrates a 10-ton automatic hydraulic cylinder with a vacuum chamber and dual heated platens, delivering precise, repeatable thermal pressing for research and industrial lab environments. The system is engineered for rapid processing under vacuum or inert gas, ensuring high-quality sample preparations with minimal cycle times.
Primary applications include polymer film lamination, battery electrode bonding, advanced ceramic compaction, and thin-film processing. It serves academic research labs, industrial R&D, and quality control facilities that demand uniform heating and accurate pressure control for material development and small-scale production.
Built with CE-certified components and a rugged steel frame, this unit ensures long-term reliability under demanding daily use. The high-capacity vacuum pump and responsive PID controller maintain consistent performance, while the automatic hydraulic system reduces operator intervention, delivering reproducible results run after run.
Key Features
- US Lab Grid Compatibility: Operates on standard AC 208V/60Hz single-phase power, allowing direct connection to North American academic and industrial electrical grids without the need for voltage transformers.
- Rapid Vacuum Pull-Down: The included 240 L/min (8.5 CFM) rotary vane pump evacuates the compact chamber to <−0.1 MPa in under 2 minutes, dramatically accelerating process cycles.
- Generous Heated Platens: Symmetrical 200 mm × 200 mm platens with a 3500W heating element array provide uniform temperatures from ambient to 300°C, ideal for large-area laminates and flexible films.
- Responsive Pressure Control: The automatic hydraulic system delivers a maximum load of 10 Tons with ±0.1 Ton accuracy, programmed via an intuitive touchscreen for precise force application.
- Inert Gas Compatibility: The SUS-reinforced chamber allows vacuum cycles followed by nitrogen or argon purging, protecting oxygen-sensitive materials from oxidation.
- Modular Control Architecture: Choose between the standard PID touchscreen controller or an optional advanced Siemens PLC with multi-step profiling, recipe storage, and data logging.
- Pressure Flexibility: While full-platen coverage yields a contact pressure of 2.5 MPa, using a smaller die (e.g., ∅50 mm) concentrates the 10-ton force to achieve 50.9 MPa for high-pressure powder compaction.
Applications
| Application | Description | Key Benefit |
|---|---|---|
| Polymer Film Lamination | Laminating polymer sheets or films under heat and vacuum to create multilayer structures. | Uniform pressure and temperature prevent warping and voids. |
| Battery Electrode Bonding | Bonding electrode materials onto current collectors for lithium-ion or solid-state batteries. | Inert gas purge prevents oxidation, ensuring high conductivity. |
| Powder Compaction (with Dies) | Compacting metal, ceramic, or composite powders into dense pellets using a smaller die. | High pressure up to 50.9 MPa achievable with ∅50 mm die. |
| Thin-Film Processing | Curing and annealing thin films for electronics and sensor applications. | Precise temperature control up to 300°C with vacuum environment. |
| Ceramic Sintering | Initial stage sintering of ceramic green bodies under combined heat and pressure. | Reduced porosity and improved mechanical properties. |
| Composite Material Curing | Curing carbon fiber or glass fiber composite prepregs. | Even pressure distribution ensures lamination quality. |
| Organic Electronics Encapsulation | Encapsulating sensitive organic electronic devices under inert atmosphere. | Oxygen-free environment extends device lifetime. |
Technical Specifications
| Parameter | Specification | Notes |
|---|---|---|
| Model | XP32 | Automatic heated vacuum press |
| Max Working Pressure | ≤ 10 Tons (100 kN) | Controlled via programmable system |
| Pressure Accuracy | ± 0.1 Ton (1 kN) | High-precision load feedback |
| Platen Working Temp | Room Temp (RT) – 300 °C | Programmable PID touchscreen |
| Heating Power | 3500 W | High-density heating element array |
| Platen Dimensions | 200 mm × 200 mm | Ground flat platens |
| Platen Opening (Daylight) | 50 mm | Compact opening for fast vacuum cycle |
| Vacuum Pump Included | Rotary Vane Mechanical Pump | Standard inclusion |
| Vacuum Pump Displacement | 240 L/min (8.5 CFM) | High-speed evacuation capacity |
| Ultimate Vacuum Level | <−0.1 MPa | Relative gauge pressure |
| Working Atmosphere | Nitrogen (N₂) / Argon (Ar) | Vacuum-and-purge compatible |
| Power Supply | AC 208V / 60Hz (Single Phase) | Optimized for US institutional facilities |
| Certification | CE Certified | Standard safety compliance |
Pressure & Area Engineering Note: The maximum mechanical capacity is 10 Tons (100 kN). Because the platen area is 200×200 mm, the maximum applied contact pressure on a full-area sample is 2.5 MPa (362 psi). For high-pressure powder compaction (>20 MPa), use a smaller die (e.g., ∅50 mm) which yields 50.9 MPa at full load.
Control System Options
| Option | Standard Controller (Included) | Advanced Industrial PLC Upgrade (Optional) |
|---|---|---|
| Interface | 7-inch color touchscreen | Siemens industrial PLC with high-res touchscreen |
| Core Functions | Basic PID temperature profiling, target pressure input, auto-holding, automated timed decompression | Complex multi-step temperature/pressure profiling, recipe storage (up to 99 profiles), precision load-cell feedback, Ethernet data logging |
| Best For | Standard lamination, polymer curing, simple pellet pressing | Academic research, ASTM test standards, processes requiring precise step-by-step pressure compensation |
Why Choose This Product
- Proven Long-Term Reliability: Engineered with industrial-grade vacuum and hydraulic components, this press delivers consistent performance through years of continuous lab operation, minimizing downtime.
- Precision Engineering: Ground flat platens, advanced load-cell feedback, and rigid frame construction ensure uniform pressure distribution and repeatable results, critical for quality research and production.
- Flexible Customization: The modular control architecture allows you to start with the standard touchscreen and later upgrade to an advanced PLC system as your process requirements evolve, without replacing the entire unit.
- Certified Safety & Compliance: CE certification and US grid-compatible power supply simplify integration into institutional labs, meeting stringent safety and electrical standards.
- Expert Support: Our responsive technical team provides dedicated application guidance and after-sales assistance to keep your processes optimized and productive.
Contact us today to discuss your specific application or request a customized quotation.
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