High Temperature Dip Coating Machine

Product Overview

This high-temperature dip coating system is designed for research workflows that require controlled immersion, programmed withdrawal, and rapid thermal consolidation of liquid-phase film materials. A substrate is secured beneath the withdrawal wire, lowered into the loading box for immersion, then returned through the furnace tube for heating and film solidification. Its integrated furnace supports a rated heating temperature of 1000°C, extending dip-coating work well beyond conventional low-temperature equipment.

The equipment is suited to thin-film growth and coating studies involving ceramic films, crystal films, battery-material films, and specialized nanofilms. Universities, research institutes, and industrial laboratories can use the unit where repeatable coating motion and a defined thermal profile are important to experimental development. It accommodates operation in nitrogen, argon, other safe inert protective gases, or oxidizing atmospheres.

Reliability is built around PLC program control, a high-precision stepper motor, and suspended-wire transmission intended to reduce vibration during withdrawal. Three independently programmed speed zones align the mechanical movement with low-temperature, high-temperature, and cooling stages. The resulting process platform gives researchers a practical way to develop high-temperature film-forming methods with controlled movement, clear operation, and straightforward cleaning.

Key Features

• 1000°C Rated Heating Environment: The integrated high-temperature furnace has a rated heating temperature of 1000°C and a maximum heating temperature of 1100°C. It enables coating and curing studies for materials that cannot be adequately processed in conventional systems limited to temperatures below 200°C.

• Three Independently Set Withdrawal Zones: The motion path is divided into fixed low-temperature, high-temperature, and cooling zones. Each zone can be assigned its own withdrawal speed from 1-200 mm/min, allowing the travel profile to be matched to immersion, heating, and cooling requirements.

• PLC-Controlled Precision Drive: PLC program control and a high-precision stepper motor deliver repeatable programmed movement. The suspended-wire transmission approach supports vibration reduction during vertical travel, helping maintain stable handling of lightweight substrates and wet coatings.

• Controlled Dwell for Thermal Processing: Baking dwell time is adjustable from 1-999 s. This provides a defined hold period for film solidification inside the thermal process sequence without requiring operators to manually time each cycle.

• Atmosphere Compatibility: The system can operate with nitrogen, argon, and other safe inert protective gases, as well as in oxidizing atmospheres. This flexibility supports material studies that require atmosphere selection during high-temperature film treatment.

• Defined Substrate and Load Capability: The equipment accommodates sample substrates measuring L75 mm x W25 mm x D1-4 mm and supports a maximum withdrawal load of <=200 g. A 60 mm effective immersion length establishes the usable dip range for the specified configuration.

• Accurate Furnace Temperature Control: An intelligent multi-stage temperature controller, K-type thermocouple, and stated control accuracy of +/-1°C support controlled furnace operation. The recommended heating rate is 10°C/min for managed thermal ramping.

• Operator-Focused Touchscreen Interface: A 4.3-inch color touchscreen presents a simple, clear control interface suitable for routine laboratory operation. The design supports efficient parameter setting for users developing or repeating coating programs.

• High-Temperature Wire Consideration: The standard withdrawal wire is intended for working temperatures up to 800°C. Work between 800°C and 1000°C requires a specially customized wire or a wire supplied by the customer, ensuring the mechanical component is selected for the intended thermal duty.

Applications

Technical Specifications

The specified travel geometry creates a defined sequence through the low-temperature zone, the high-temperature zone, and the cooling zone. Because the individual travel distances are fixed, researchers can focus process development on the independently adjustable speed settings, baking dwell time, furnace temperature program, and selected atmosphere. This provides a clear basis for recording and repeating experimental conditions across coating trials.

The furnace tube and chamber dimensions should be reviewed against the intended substrate fixture and experimental setup before procurement. The stated substrate size, immersion length, and withdrawal-load limit describe the standard operating envelope. For applications that require operation above 800°C, the withdrawal wire arrangement should be confirmed during specification because the standard wire is intended for use up to 800°C.

Why Choose This Product

• Purpose-built high-temperature capability: This system combines programmed dip withdrawal with furnace-based processing at a rated 1000°C, providing a focused platform for film-growth research that requires elevated thermal conditions.

• Repeatable mechanical process control: PLC control, a high-precision stepper motor, suspended-wire transmission, three adjustable speed stages, and configurable dwell time support consistent experimental motion from cycle to cycle.

• Process flexibility without unnecessary complexity: Inert or oxidizing atmosphere operation, multi-stage temperature control, and a 4.3-inch touchscreen allow laboratories to configure core conditions directly for their material-development workflow.

• Defined engineering limits for reliable specification: Clear limits for substrate dimensions, effective immersion length, withdrawal load, fixed travel zones, furnace dimensions, and high-temperature wire requirements help procurement teams evaluate fit before installation.

• Prepared for evolving film-forming research: The design is intended to address future high-temperature film-forming technology needs while remaining suitable for routine work in academic, institutional, and industrial laboratories.

Contact us for a quote or a custom solution, including confirmation of high-temperature withdrawal-wire and AC110V furnace requirements for your process.

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