Laboratory Heated Press
Automatic Large Area Laboratory Hot Press Laminator 15 Ton 500x500mm Heated Platens Data Logging CE Certified
Item Number : XP82
Price varies based on specs and customizations
- Max Pressure
- 15 Tons (150 KN)
- Platen Size
- 500×500 mm (19.7×19.7 inch)
- Temperature Range
- 0 – 200 ℃
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Product Overview
This fully automatic hydraulic hot press and laminator is engineered to meet the demanding requirements of large-area lamination for thin sheets, multilayer composites, PCBs, and flexible electronics. Its massive 500×500 mm platens and 15-ton pressure capacity ensure uniform force distribution, making it ideal for precision low-pressure molding and curing applications. The system integrates a 12 kW heating system with independent dual-platen PID temperature control, delivering consistent thermal performance across the entire working surface while built-in data logging and USB export provide complete process traceability.
Designed for both research laboratories and pilot production environments, this equipment excels in processing materials that require precise temperature and pressure profiles. Typical users include universities, materials science institutes, electronics manufacturers, and battery research facilities that need reliable data traceability for quality assurance and process optimization. The unit’s robust construction and advanced automation reduce operator intervention while maximizing repeatability, making it an essential tool for process development and small-batch production.
Built to operate continuously under demanding conditions, the press features a closed-loop hydraulic system that maintains stable pressure throughout the programmed cycle. Its safety interlocks and CE certification reflect a commitment to operator safety and international standards. With an English touchscreen interface and USB data export, it seamlessly integrates into modern lab data management workflows, providing confidence in every lamination task and supporting compliance with rigorous auditing requirements.
Key Features
- Large-Format Precision Platens: The 500×500 mm heated platens provide an expansive working area for large-area sheets and panels. Precision-ground surfaces ensure even pressure distribution and excellent parallelism, critical for uniform laminate quality across the entire part. The robust construction minimizes deflection under load, guaranteeing consistent results.
- Independent Dual-Platen PID Temperature Control: Each platen is equipped with its own PID controller, allowing independent programming of heating rates and setpoints. This dual-zone control eliminates thermal gradients and ensures consistent material properties across the entire part, even for thick or multilayered substrates.
- 12 kW High-Power Heating System: With a total heating capacity of 12 kW (2×6,000 W), the system achieves rapid warm-up and maintains stable temperatures up to 200 ℃. This high power density minimizes cycle times, enhances productivity, and ensures uniform heat distribution across the large platens.
- Programmable 8-Segment Pressure and Temperature Profiles: The 7-inch color touchscreen enables users to define complex multi-step recipes with precise control over pressure ramps, dwell times, and temperature transitions. The PLC-based controller automates the entire cycle for walk-away operation, improving reproducibility and reducing operator error.
- Closed-Loop Hydraulic Pressure Compensation: An internal hydraulic system with automatic feedback maintains set pressure within tight tolerances, even as material thickness changes during curing. This ensures consistent lamination pressure without manual adjustments, critical for achieving uniform bond lines and preventing defects.
- Smart Data Logging and USB Export: Built-in data acquisition records real-time temperature and pressure data for each cycle. Data can be exported as CSV files via USB for further analysis, supporting quality documentation, process validation, and audit trails in regulated environments.
- Rapid Water Cooling Integration: The press includes integrated cooling channels and control for an optional water chiller. When connected, the system can automatically circulate cooling water to rapidly bring platens to a safe temperature before opening, significantly reducing cycle time and protecting heat-sensitive materials.
- Safety and Compliance: The unit is equipped with a safety door that immediately halts operation when opened, and it carries CE certification. This ensures compliance with laboratory safety regulations and provides operator protection, making it suitable for shared lab environments.
Applications
| Application | Description | Key Benefit |
|---|---|---|
| PCB Lamination | Bonding multiple layers of printed circuit boards under controlled heat and pressure. | Achieves defect-free lamination with precise alignment, essential for high-reliability electronics. |
| Flexible Electronics Assembly | Laminating conductive and dielectric layers for flexible displays, sensors, and wearable devices. | Low-pressure capability prevents damage to delicate substrates while ensuring uniform bonding. |
| Multilayer Composite Fabrication | Manufacturing fiber-reinforced composites with thermoplastic or thermoset matrices. | Programmable profiles optimize resin flow and cure cycle, improving mechanical properties. |
| Battery Component Lamination | Pressing battery electrodes, separators, and solid-state electrolyte layers. | Controlled pressure and temperature enhance interfacial contact and ionic conductivity. |
| Polymer Film Pressing & Bonding | Thermal bonding of polymer sheets or films for packaging and barrier applications. | Uniform heating prevents warping and ensures consistent seal integrity. |
| Research & Development of New Materials | Process development for novel composites, nanomaterials, and thin-film devices. | Data logging and programmability enable systematic process optimization and reproducibility. |
| Quality Control & Pilot Production | Simulating full-scale production processes on a laboratory scale. | Accurate pressure and temperature control mimic production conditions, reducing scale-up risks. |
| Laminating Printed Electronics | Encapsulation and bonding of printed electronic circuits on various substrates. | Gentle pressure and precise temperature protect ink structures while achieving reliable lamination. |
Technical Specifications
| Parameter | Specification | Notes |
|---|---|---|
| Model | XP82 | |
| Platen Size | 500×500 mm (19.7×19.7 inch) | Suitable for large-area sheets, panels, and multi-layer laminates |
| Max Pressure | 15 Tons (150 KN) | Hydraulic source, adjustable 0.5 – 15T in closed-loop control |
| Max Specific Pressure | Approx. 0.6 MPa (6 kg/cm² / 87 psi) | Calculated over full platen area; verify suitability for your material |
| Temperature Range | 0 – 200 ℃ | Optimized for medium-low temperature thermosets and thermoplastics |
| Heating Power | 12 kW (2×6,000 W) | Dual-zone heating for rapid, uniform temperature distribution |
| Temperature Control | Dual platen independent programmable PID | Anti-overshoot, heating rate adjustable; ensures precision thermal management |
| Daylight (Max Platen Opening) | 60 mm | Designed for thin sheets, films, PCB molding, and flat laminates |
| Pressure Control | 8-segment programmable pressure/dwell control | Closed-loop automatic pressure holding and smooth pressure release |
| Controller | 7-inch color touchscreen, English interface | Real-time temperature and pressure curve display; stores multiple recipes |
| Data Management | Built-in data logging | Records process data; USB export to CSV for easy archiving and analysis |
| Power Requirement | AC 3-Phase 400V / 50Hz | Typical operating current ~20A per phase; industrial power connection |
| Cooling Method | Integrated water cooling channels | Requires external chiller loop; optional chiller available for automated cooling |
| Host Dimensions | 1250×750×1300 mm (W×D×H) | Floor-standing design; sturdy welded frame with leveling feet |
| Safety Features | Safety interlock door; automatic stop when opened | CE certified; compliant with EU laboratory safety standards |
| Optional Water Chiller | Price SGD 2,500 (EXW) | Compact, mobile design with casters; automatically controlled via press PLC |
| Chiller Dimensions | 470×670×890 mm (W×D×H) | Space-saving footprint; easy to position beside the press |
| Chiller Control | Automatic operation during cooling phase | Integrated solenoid valve control; one-key full cycle automation |
Why Choose This Product
- Proven Reliability for Demanding Applications: This press is built on a robust hydraulic platform designed for continuous operation. Its closed-loop pressure control and heavy-duty welded frame ensure consistent performance over thousands of cycles, reducing maintenance and downtime.
- Precision Engineering for Superior Laminates: The independently controlled dual platens and precision-ground surfaces deliver unmatched temperature uniformity and parallelism, critical for high-quality multilayer composites and electronics. Manufacturing tolerances are held to exacting standards to guarantee repeatable results.
- Full Compliance and Data Integrity: With CE safety certification and comprehensive data logging with USB export, the system meets the strict requirements of accredited laboratories and regulated industries. Every cycle is documented, ensuring traceability and audit readiness for ISO and GLP environments.
- Customizable Process Control: The 8-segment programmable controller adapts to a wide range of materials, from delicate films to stiff composite sheets. Its versatility makes it a long-term asset as your research evolves, supported by KINTEK’s application expertise.
- Global Support and Service: KINTEK provides responsive technical support, installation assistance, and customization options to integrate this press into your specific workflow. Our team ensures you get maximum value from your investment, from initial setup to ongoing operation.
Contact us today to discuss your lamination needs and request a customized quote for this high-performance laboratory hot press.
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