Laboratory Heated Press
24 Ton 200x200mm Integrated Heating Press for Laboratory Sample Preparation
Item Number : XP55
Price varies based on specs and customizations
- Maximum Pressing Force
- 0 – 24 tons
- Platen Temperature Range
- Ambient – 300 °C
- Platen Size
- 200 × 200 mm
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Product Overview

This integrated heating press combines a robust 24-ton hydraulic system with precisely controlled heated platens, delivering uniform pressure and temperature across large 200x200mm work areas. The unit is engineered for high-throughput laboratory environments where consistent, repeatable thermal compression is critical for sample preparation, such as battery electrode consolidation and polymer film lamination. Its compact, all-in-one design integrates the press frame, hydraulic power unit, and temperature control into a single benchtop footprint, minimizing installation complexity and maximizing operational convenience.
Primary applications span battery research—particularly solid-state electrolyte pellet formation—polymer film embossing, and advanced material testing. This system is widely adopted in university labs, institutional research centers, and quality control facilities needing reliable hot pressing up to 24 tons with precise thermal control to 300°C. Its water-cooled platens enable rapid cycling between temperature setpoints, reducing cooldown times by up to 60% and significantly boosting daily throughput.
Engineered for demanding daily use, every component from the hardened steel platens to the PID temperature controller is selected for long-term stability. The unit delivers consistent pressure holding and uniform heat distribution, ensuring specimen integrity even during extended runs. With over a decade of field-proven performance across global installations and comprehensive CE safety certification, this press represents a premium investment in lab productivity and operator safety.
Key Features
- High-Force Capacity: The hydraulic system delivers up to 24 metric tons of clamping force with a closed-loop servo control, ensuring pressure accuracy of ±0.5% and holding stability even during long dwell times. This wide force range accommodates everything from delicate polymer films to dense metal powders.
- Dual-Zone PID Temperature Control: Each 200x200mm platen is equipped with an independent 600W heating element and a K-type thermocouple for precise closed-loop regulation. The advanced PID algorithm maintains a temperature stability of ±2°C across the full range from ambient to 300°C, with a heating rate adjustable up to 15°C/min.
- Integrated Water Cooling: Active water circulation through machined cooling channels reduces platen temperature from 300°C to 60°C in under 10 minutes, a 60% improvement over natural convection. Quick-release fittings and a closed-loop chiller option minimize water consumption and mess.
- Rigid All-Steel Frame: The frame is fabricated from thick-gauge steel plates with stress-relieved welds, and the upper platen is guided by four precision-ground linear bearings. This construction maintains platen parallelism within 0.05 mm over the entire 50 mm stroke, eliminating uneven compaction and specimen taper.
- User-Friendly Digital Interface: A 4.3-inch color touchscreen provides intuitive access to all functions, including multi-step program creation with up to 10 ramp/soak segments per recipe. Real-time trends of pressure and temperature are displayed graphically, and data can be exported via USB for quality traceability.
- Safety Interlocks: Operation requires simultaneous two-hand activation to keep the operator clear of the press zone, compliant with CE safety directives. An integrated mechanical stop and hydraulic relief valve prevent over-travel and over-pressure, safeguarding both the user and the equipment.
- Wide Platen Format: The generous 200×200 mm working surface allows processing of multiple small samples or one large mold, increasing throughput. Optional adapter plates can accommodate various mold sizes, making the press versatile for diverse sample geometries.
- Benchtop Integration: With overall dimensions of only 950×260×525 mm and an integrated hydraulic and cooling system, this press fits neatly on a standard lab bench, requiring only a single 220V/50Hz power connection—no external chiller or air supply needed.
- Data Logging & Connectivity: The controller supports USB export of pressure and temperature logs for GxP documentation, and an optional RS-232 interface enables integration with lab LIMS systems.
Applications
| Application | Description | Key Benefit |
|---|---|---|
| Battery Electrode & Electrolyte Pressing | Consolidation of cathode/anode powders and formation of solid-state electrolyte pellets for lithium-ion and next-gen battery cells. | Uniform density distribution prevents hot spots and ensures consistent ionic conductivity across the pellet. |
| Polymer Film Embossing & Lamination | Thermal bonding of multi-layer polymer films, microfluidic chip sealing, and surface texturing for lab-on-a-chip devices. | Precise temperature and pressure control preserves delicate nanostructures without thermal degradation. |
| FTIR & XRF Pellet Preparation | Production of transparent KBr pellets for infrared spectroscopy and fused beads for X-ray fluorescence analysis. | Eliminates air inclusions and thickness variations, delivering reproducible spectral baselines. |
| Composite Material Development | Hot pressing of metal-matrix composites, ceramic-reinforced polymers, and carbon fiber pre-preg consolidation. | Maximizes fiber wet-out and void elimination under controlled heat and pressure profiles. |
| Pharmaceutical Tablet Pilot Production | Small-batch compression of powder blends into tablets for formulation trials and stability studies. | Full data logging of pressing parameters aids FDA/EMA documentation and scale-up studies. |
| Powder Metallurgy Sintering | Pre-compaction of metal and ceramic powders at elevated temperatures prior to final sintering. | Increases green density and reduces sintering shrinkage, improving net-shape accuracy. |
| Semiconductor Wafer Bonding | Thermal compression bonding of silicon wafers or chip-on-flex assemblies using controlled force and temperature. | Achieves uniform bond lines without voiding, critical for micro-electromechanical systems (MEMS) fabrication. |
Technical Specifications
| Parameter | XP55 |
|---|---|
| Model | XP55 |
| Press Capacity | 0 – 24 tons |
| Platen Working Temperature | Ambient – 300 °C |
| Heating Power (Total) | 1200 W (2 × 600 W) |
| Platen Dimensions | 200 × 200 mm |
| Platen Cooling | Integrated water circulation |
| Temperature Control | Dual-zone PID with ±2 °C stability |
| Display & Control | 4.3-inch touchscreen, programmable |
| Power Supply | 220 V, 50 Hz, single-phase |
| Overall Dimensions (W × D × H) | 950 × 260 × 525 mm |
| Net Weight | 180 kg |
Why Choose This Product
- Proven Reliability: Over 15 years of continuous service in demanding research environments worldwide have demonstrated a mean time between failures exceeding 10,000 cycles. The hydraulic seals and heating elements are rated for extended high-temperature operation, and routine maintenance is limited to occasional cleaning and seal inspection.
- Precision Engineering: CNC-machined platens are surface-ground to a flatness of less than 0.03 mm, and the four guide columns are precision-honed to maintain parallelism within 0.05 mm across the full stroke. This eliminates sample taper and ensures consistent thickness in every pressed pellet or laminate.
- Rapid Thermal Response: Low thermal mass platens combined with active water cooling enable cycle times as fast as 8 minutes from 300°C to 60°C. This rapid turnaround maximizes lab productivity, particularly in multi-shift operations where time between runs is critical.
- Global Compliance & Support: The electrical system is CE-certified and factory-configured for 220V/50Hz single-phase power, with plug-and-play installation. Dedicated application engineers provide unlimited remote technical support, and spare parts are stocked globally for immediate dispatch.
- Customization Ready: Optional mold adapters, vacuum enclosures, and data export modules allow the press to be tailored to specific process requirements. Whether you need an inert atmosphere glovebox integration or custom tooling for unusual sample geometries, our engineering team can deliver a turnkey solution. Contact us to configure your exact system and request a DDP shipping quotation.
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Product Datasheet
24 Ton 200x200mm Integrated Heating Press for Laboratory Sample Preparation
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