Products Laboratory Press Machine Automatic Heated Lab Press 40 Ton Split Type Hot Press with 400x400mm Platens for Polymer Lamination Composite Curing and Semiconductor Bonding
40 Ton Split Type Hot Press with 400x400mm Platens for Polymer Lamination Composite Curing and Semiconductor Bonding

Automatic Heated Lab Press

40 Ton Split Type Hot Press with 400x400mm Platens for Polymer Lamination Composite Curing and Semiconductor Bonding

Item Number : XP34

Price varies based on specs and customizations


Max Working Pressure
≤ 40 Tons (400 kN)
Platen Dimensions
400 mm × 400 mm
Platen Working Temperature
Room Temp to 300 °C
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Product Overview

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The 40-ton split-type hot press is an industrial-grade thermal pressing platform designed for demanding large-area applications. Its massive 400 mm × 400 mm heated platens and 40-ton hydraulic capacity deliver uniform temperature and pressure distribution essential for high-quality laminations and bonds.

A defining feature of this system is its split-type architecture, which separates the heavy press frame from the control console. This modular design enables easy integration into gloveboxes, fume hoods, or cleanrooms, protecting sensitive electronics from heat and chemical exposure while enhancing operator safety.

Built for continuous operation in research and production environments, the press combines robust mechanical construction with precise PID temperature control and programmable pressure cycles. Its CE compliance and multiple configuration options ensure reliable performance across a wide range of industrial processes.

Key Features

  • Split-Type Modular Architecture: The press frame is physically isolated from the control console, allowing the heavy mechanism to be placed inside controlled environments while the operator manages processes externally. This layout protects sensitive control electronics from thermal stress and chemical vapours.
  • Large-Area Heated Platens: The 400 mm × 400 mm platens feature high-density symmetrical heating elements, providing uniform temperature from room temperature up to 300 °C across the entire surface. This ensures consistent results even with full-size samples.
  • Advanced Touchscreen PID Control (Automatic Models): A 7-inch intuitive touchscreen allows programming of multi-step temperature ramps and pressure cycles, including automated pressurization, holding, and decompression. Stored profiles enable repeatable process control.
  • Circulating Water Cooling: Integrated water channels within the platens actively cool the hydraulic seals during prolonged high-temperature runs, extending seal life and enabling rapid post-process cooling for faster cycle times.
  • Air-Freight-Optimized Configuration: A special variant reduces shipping costs for international buyers by minimizing crate dimensions, achieving a compact opening height of 150 mm and piston stroke of 50 mm while retaining the full 40-ton force.
  • Versatile Configurations: Available in Standard Automatic, Air-Freight Automatic, and Heavy-Duty Manual editions, catering to diverse operational, facility, and budget requirements. The manual version offers a cost-effective solution with a hand-pump hydraulic system.

Applications

Application Description Key Benefit
Polymer Lamination Hot pressing of polymer films, sheets, or multilayer laminates for flexible electronics and packaging. Uniform heat and force across large areas prevent delamination and air entrapment.
Composite Curing Curing of fiber-reinforced composites, prepregs, and structural panels for aerospace and automotive components. High force and precise temperature profiles ensure complete resin flow and void reduction.
Semiconductor Bonding Thermal compression bonding of wafers, substrates, or chip-on-flex assemblies in cleanroom settings. Split architecture enables glovebox integration, protecting air-sensitive materials.
Multi-layer PCB Pressing Lamination of multi-layer printed circuit boards requiring high pressure and temperature uniformity. Large platen size and programmable cycles guarantee consistent layer adhesion.
Powder Compaction Compaction of metal, ceramic, or composite powders into green bodies using custom dies. With a small die (e.g., Ø100 mm), contact pressure reaches 50.9 MPa, ideal for sintering studies.
Diffusion Bonding Solid-state joining of metals or ceramics under high temperature and pressure in inert atmospheres. Glovebox compatibility and programmable multi-step profiles support advanced material research.
Battery Electrode Pressing Pressing of cathode/anode sheets or solid-state electrolyte layers for lithium-ion batteries. Suitable for air-sensitive materials when frame is installed in an argon-filled glovebox.
Mould Pressing / Hot Embossing Microstructure replication on polymer substrates using heated moulds and controlled force. Precise pressure and temperature control achieve high-fidelity feature transfer.

Technical Specifications

Parameter XP34-Standard XP34-AF-Opt XP34-Manual
Maximum Working Pressure ≤ 40 Tons (400 kN) ≤ 40 Tons (400 kN) 0 – 40 Tons (400 kN)
Pressure Control Touchscreen Programmable Touchscreen Programmable Manual Hand Pump
Platen Dimensions 400 mm × 400 mm 400 mm × 400 mm 400 mm × 400 mm
Platen Working Temperature Room Temp (RT) – 300 °C Room Temp (RT) – 300 °C Room Temp (RT) – 300 °C
Heating Configuration Dual-platen independent Dual-platen independent Dual-platen symmetrical
Rated Heating Power 7,200 W (2 × 3,600 W) 6,000 W (2 × 3,000 W) 6,000 W (Total)
Piston Stroke 60 mm 50 mm Manual Travel
Platen Opening (Daylight) 180 mm 150 mm 60 mm
Platen Cooling Method Circulating Water Cooling Circulating Water Cooling Circulating Water Cooling
Control Console 7-inch touchscreen PID 7-inch touchscreen PID Analogue Gauge / PID Dial
Power Supply AC 220V / 50Hz (Single-Phase) AC 220V / 50Hz (Single-Phase) AC 380V / 50Hz (Three-Phase)
External Dimensions 850 × 480 × 650 mm 850 × 480 × 650 mm 850 × 480 × 650 mm
Net Weight 480 kg 480 kg 550 kg
Certification CE compliant CE compliant Standard Industrial

Pressure and Area Engineering Note: The maximum mechanical capacity is 40 Tons (400 kN). However, the applied contact pressure depends on the sample or die size. For a full 400 × 400 mm sample, the maximum contact pressure is 2.5 MPa (362 psi), ideal for polymer and composite sheets. For concentrated pressing, using a smaller die yields higher pressure. For example, a 40-ton load on a Ø100 mm die produces 50.9 MPa (7,382 psi). Always ensure tooling is rated for the applied force.

Installation & Facility Requirements

  • Heavy-Duty Workbench: The press weighs 480–550 kg and must be installed on a structurally reinforced bench or steel floor stand. Use appropriate hoisting equipment.
  • Electrical: Automatic models require AC 220V/50Hz single-phase power with a dedicated 40A circuit breaker. The manual model requires AC 380V/50Hz three-phase power.
  • Water Cooling: Connect the built-in water channels to a laboratory water supply or an external recirculating chiller for effective platen cooling.

Standard Packing List

  • XP34 Split-Type Press Frame × 1
  • Control Console / Hydraulic Pump Unit × 1
  • High-Pressure Hydraulic Hoses & Signal Cables × 1 Set
  • Water Cooling Jacket Connections × 1 Set
  • Quality Certificate & Operations Manual × 1

Why Choose This Product

  • Engineered for Demanding Environments: The split-type design physically isolates the press mechanism from control electronics, ensuring long-term reliability even when used inside gloveboxes, fume hoods, or high-temperature areas.
  • Precision and Repeatability: Automatic models use a programmable PID touchscreen with stored recipes, enabling consistent multi-step temperature and pressure profiles for reproducible batch processing.
  • Global Shipment Ready: The Air-Freight-Optimized configuration reduces crate size and shipping costs without compromising the 40-ton capacity, making it ideal for international laboratories and manufacturers.
  • CE Certified Safety: All standard automatic configurations are CE compliant, meeting stringent European safety and electromagnetic compatibility standards.
  • Flexible Configuration Options: Three distinct variants—Standard Automatic, Air-Freight Automatic, and Heavy-Duty Manual—allow you to match the press to your facility’s power, space, and automation needs.
  • Comprehensive Support: KINTEK provides detailed installation guidance and dedicated after-sales support to ensure your press operates at peak performance from day one.

Contact us today to request a tailored quote or to discuss custom press solutions for your specific application requirements.

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Product Datasheet

40 Ton Split Type Hot Press with 400x400mm Platens for Polymer Lamination Composite Curing and Semiconductor Bonding

Category Catalog

Automatic Heated Lab Press


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